Process Tools and Photonic Packaging for Optical Connectivity
Achieve consistent optical quality across many variants – in your own production or with our packaging service.
AMS Technologies supplies tools and instrumentation for patch cord manufacturing and the post-processing of photonic components such as photonic integrated circuits (PICs), waveguides and v-grooves, and helps your team turn them into controlled, repeatable processes. Our business unit Bay Photonics in Paignton, UK, packages lasers, detectors, sensors and hybrid PICs, from proof of concept and prototypes to high-mix, low-volume production.
Solve Your Challenges in Optical Connectivity & Integration
Reduce variability without over-automating
Patch cord assembly and component post-processing rely heavily on individual operator technique, while rigid automation can conflict with frequent changeovers. We combine semi-automated tools with guided manual steps, so critical quality steps depend less on the individual operator.
Keep fiber and chip alignment stable
Coupling light between a laser, a PIC and a fiber often requires sub-micron alignment, and the alignment has to hold while the adhesive cures, through temperature changes and over the device’s lifetime. We supply alignment and coupling tools for in-house assembly, and Bay Photonics aligns fibers, fiber arrays and micro-optics as a service, choosing the coupling method to suit the device.
Achieve consistent quality across many variants.
High-mix production includes different fiber types, connector standards, component designs and coupling concepts. We build workflows with a common base and variant-specific steps, so new variants build on an existing process.
Make quality measurable and reproducible
Consistent results must be verifiable and traceable across operators, shifts and batches. We define measurable quality criteria and inspection steps and document the workflow, so results can be compared and traced.
Find packaging capacity for prototypes and small batches
Automated packaging lines need large quantities to cover setup and qualification. Bay Photonics packages prototypes, qualification batches and high-mix, low-volume series in Europe, from a single process step such as wire bonding to a complete module.
Move new designs and processes into production
A process developed on a few prototypes often does not transfer directly to production. We define processes, select tools and train operators. In packaging, Bay Photonics carries the parameters found on the prototype into production.
Reduce variability without over-automating
Patch cord assembly and component post-processing rely heavily on individual operator technique, while rigid automation can conflict with frequent changeovers. We combine semi-automated tools with guided manual steps, so critical quality steps depend less on the individual operator.
Keep fiber and chip alignment stable
Coupling light between a laser, a PIC and a fiber often requires sub-micron alignment, and the alignment has to hold while the adhesive cures, through temperature changes and over the device’s lifetime. We supply alignment and coupling tools for in-house assembly, and Bay Photonics aligns fibers, fiber arrays and micro-optics as a service, choosing the coupling method to suit the device.
Achieve consistent quality across many variants.
High-mix production includes different fiber types, connector standards, component designs and coupling concepts. We build workflows with a common base and variant-specific steps, so new variants build on an existing process.
Make quality measurable and reproducible
Consistent results must be verifiable and traceable across operators, shifts and batches. We define measurable quality criteria and inspection steps and document the workflow, so results can be compared and traced.
Find packaging capacity for prototypes and small batches
Automated packaging lines need large quantities to cover setup and qualification. Bay Photonics packages prototypes, qualification batches and high-mix, low-volume series in Europe, from a single process step such as wire bonding to a complete module.
Move new designs and processes into production
A process developed on a few prototypes often does not transfer directly to production. We define processes, select tools and train operators. In packaging, Bay Photonics carries the parameters found on the prototype into production.
Optical connectivity covers every point where light passes between fibers, chips and optics: patch cords and multi-fiber assemblies, fiber-to-PIC interfaces, and packaged lasers and detectors. At each of these points, process quality determines optical losses, yield and long-term stability. Most of this work takes place in high-mix, low-volume environments with tight tolerances, frequent changeovers and a strong dependence on individual technique. AMS Technologies works with manufacturers of patch cords and photonic components, PIC developers and OEMs, whether they run these processes in-house or outsource them.
Our Capabilities in Optical Connectivity & Integration
Tooling & Instrumentation
We select tools and equipment for fiber preparation, cleaving, end-face processing, alignment, coupling and inspection to match your variants and quality targets, for both patch cord manufacturing and component post-processing.
Process Consulting & Workflow Design
Good tools need the right technique. We analyze your variants and quality targets and design workflows in which tools and manual steps work together.
Alignment & Coupling Optimization
For fiber-to-fiber, fiber-to-PIC and hybrid interfaces, we choose the coupling method that fits the device and its tolerances, from butt-coupling and lensed fibers to grating couplers, with active alignment where the tolerance requires it.
Quality Assurance & Documentation
We define quality criteria, calibration routines and inspection checkpoints, and document processes, tool setups and results. Quality decisions are then based on measurements instead of subjective judgment, and every result can be traced.
Training & Process Guidance
We train your operators in methods and tool use, so new team members reach consistent results sooner.
Photonic Packaging Services
Our business unit Bay Photonics in Paignton, UK, offers die attach, wire and ribbon bonding, optical alignment, hermetic sealing and testing, for single process steps, complete modules and the standard PIC evaluation module BEVi.
How You Benefit from AMS Technologies
Consistent quality, less dependent on operator technique
Repeatable results across patch cords, photonic components, and packaged devices
Efficient use of skilled operators in high-mix environments
Explore Further
Fibers, Fiber Optics
Optical Test Tools and Measurement
From Prototype to Product: Photonic Packaging at Bay Photonics
Streamlining Multi-Fiber Processing Step by Step
AMS Technologies Partners with Arden Photonics
Addressing the PIC Polishing Challenge with KrellTech NOVA
Press Release: AMS Technologies AG Acquires bay Photonics Ltd.
Are you ready to find your perfect solution?
We are happy to help.
How We Develop Custom Solutions for You
Many optical connectivity tasks need more than standard tools. Depending on your requirements, we select and configure tools, develop workflows with your team or package your devices at Bay Photonics, or combine these.
1
Requirements Review
Share your application, components and quality targets with us. Together we decide whether tools and process support, packaging or a combination fits best.
2
Solution Concept
We define the tooling setup and workflow, the package design and assembly process, or both.
3
Proof of Concept & Prototyping
We validate tools, workflows and inspection steps, or build and test packaged prototypes, for example in the standard BEVi module.
4
Implementation
We introduce tools and workflows in your production and train your team. For packaging, Bay Photonics moves your device from prototype to small-series production.
5
Documentation & Support
We document tool setups, workflows and packaging processes, and support later improvements.