29. Juli 2026 neoYb Amplifier Module: New Compact Footprint for OEM Integration
OEM integration often means balancing performance requirements with available space. The neoYb Amplifier Module addresses this with a 75% smaller footprint, now 180 × 80 × 40 mm, while maintaining about 30 dB amplification and over 10 W output power in the femtosecond range. Cascading multiple stages enables output powers above 100 W.
The module integrates a VBG-stabilized pump diode and passive cooling, so no external cooling setup is required. It supports applications including precision micromachining, material processing, LIDAR, and spectroscopy.
Are you interested? Discuss your project requirements with our experts!
EXPLORE MORE
NEWS & EVENTS
Fish & chips and photonics – our Europe XXIV meeting
Fish and chips, photonics, and three days together on the English Riviera. Our 24th Europe Meeting in Torquay gave us time beyond the usual day-to-day ...
Read More >
From Prototype to Product: Photonic Packaging at Bay Photonics
A photonic device that works on an optical bench is not yet a finished product. Packaging determines whether the optical alignment holds, whether heat leaves ...
Read More >
PIC Summit Europe
November 3–4, 2026
Eindhoven, NL
PIC Summit Europe is dedicated to photonic integrated circuits (PICs) and their applications in areas such as optical communications, sensing, and industrial photonics. The event ...
Read More >
